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Mr. Pai is a new associate of Vibro-Acoustic Consultants.
He has extensive experience in the supervision, management, and coordination of
fast-track, high-tech facilities design and construction. His solid understanding
of microvibration issues is complemented by his broad knowledge of structural,
architectural, mechanical, plumbing, process piping, and electrical systems.
During his tenures at Bovis Lend-Lease, Rinne & Peterson, and Rutherford & Chekene,
he has been involved with all phases of delivering workplace and manufacturing solutions:
site selection, master planning, planning, programming, architectural/engineering design,
bidding and construction. His portfolio includes major facilities in Asia and North America.
1988 - 1993 -- Rinne & Peterson, Project Engineer
1993 - 1995 -- Rutherford & Chekene, Project Manager
1995 - 1999 -- Rinne & Peterson, Vice President, Associate & Project Manager
1999 - 2002 -- Praxair Semiconductor Materials, Business Development Manager
2002 - 2003 -- Bovis Lend-Lease Microelectronics, VP Taiwan
M.S., Structural Engineering, Stanford University
B.S., Civil Engineering, National Chiao Tung University, Taiwan
Mandarin, English
Registered Civil and Structural Engineer in California
Member of the Structural Engineers Association of Northern California (SEAONC)
Ex-Member, Board of Directors – Chinese Institute of Engineers
Member of the Chinese American Semiconductor Professional Association
ASMC: Shanghai, China – 200mm Wafer Fab
MMC Technology: San Jose, California – Cleanroom Expansion
TSMC: Fab 5, Hsinchu, Taiwan – Automation Systems Seismic Bracing & Anchorage
Cypress Semiconductor: Laguna Lake, Philippines – Cleanroom Expansion
Tissue Bank International: San Rafael, California – Facility Expansion
Amkor: Lungtan, Taiwan – Cleanroom Expansion, Process Utility Upgrade
NEC: Roseville, California – G-Line 300mm Wafer Fab
UMC: Tainan, Taiwan – Tainan Site Master Planning
EiC Corporation: Fremont, California – GaAs Wafer Fab Seismic Upgrade/Retrofit
TriQuint Semiconductor: Hillsboro, Oregon – GaAs Wafer Fab Facility
LSI Logic: Gresham, Oregon – 200mm Wafer Fab Facility
Conner Peripheral: Milpitas, California – Seismic Upgrade, Service Yard Expansion
Varian: Buildings 2 & 4 (Palo Alto, California) – Seismic Retrofit and Remodeling
University of California: Berkeley Campus – Environmental Health & Safety Facility
Alza: M4 (Mountain View, California) – Facility Conversion
Affymax: Palo Alto, California – Facility Retrofit and Upgrade
Micron: Building 26 (Boise, Idaho)
UMC: Fab 12A (Tainan, Taiwan) – Peer Review of Life Safety Systems
1st Silicon: Kuching, Malaysia – Air Separation System, Bulk Gas Distribution
*note: some projects completed with other design firms.
Please read about the industries we
serve
and contact us to discuss your project needs. |
